Required projects: include IGBT chip design, IGBT assembly and modules, MOSFETs, PMIC, SiC, GaN, manufacturing of new substrate material, new assembly material, power modules, epitaxial production, power solution applications, and power-related system products.
Stages of projects: include 1) R&D stage of prototype; 2) early stage of commercialization; 3) R&D team in place but no company; 4) Startup newly established seeking for seed investment and angel round.
Form of submission: includes business proposal or feasibility study report (in ppt format preferred) of no more than 20 pages.
Please submit the project via Frank.firstname.lastname@example.org
You will get our feedback in two weeks via email or phone call depending on the projects.